型号:

2-84533-1

RoHS:无铅 / 符合
制造商:TE Connectivity描述:CONN FFC 21POS 1.25MM RT ANG
详细参数
数值
产品分类 连接器,互连式 >> FFC,FPC(扁平软线)- 连接器 - 面板安装
2-84533-1 PDF
RoHS指令信息 2-84533-1 Statement of Compliance
3D 型号 2-84533-1.pdf
标准包装 20,900
系列 -
连接器类型 顶部触点
位置数 21
间距 0.049"(1.25mm)
FFC,FCB 厚度 0.30mm
板上方高度 0.189"(4.80mm)
安装类型 通孔,直角
线缆端类型 锥形
端子 纽结引脚
锁定功能 -
特点 -
包装 散装
触点表面涂层
触点涂层厚度 -
工作温度 -40°C ~ 85°C
额定电流 1.00A
额定电压 50V
体座材料 聚对苯二甲酸丁二酯(PBT),玻璃纤维增强型
相关参数
IDT70T3519S133DRI IDT, Integrated Device Technology Inc IC SRAM 9MBIT 133MHZ 208QFP
MPC8544AVTARJ Freescale Semiconductor IC MPU POWERQUICC III 783-FCBGA
IDT70V5378S200BC8 IDT, Integrated Device Technology Inc IC SRAM 576KBIT 200MHZ 256BGA
1-84533-9 TE Connectivity CONN FFC 19POS 1.25MM RT ANG
MT29F128G08AJAAAWP-IT:A Micron Technology Inc IC FLASH NAND 128GB 48TSOP
6-520315-3 TE Connectivity CONN TRIO MATE FLX FLM 13POS TIN
IDT70V5378S166BC IDT, Integrated Device Technology Inc IC SRAM 576KBIT 166MHZ 256BGA
MPC8544AVTAQG Freescale Semiconductor IC MPU POWERQUICC III 783-FCBGA
IDT70T653MS15BC8 IDT, Integrated Device Technology Inc IC SRAM 18MBIT 15NS 256BGA
MPC8544AVTANG Freescale Semiconductor IC MPU POWERQUICC III 783-FCBGA
1-1734798-2 TE Connectivity CONN HOUSING FPC 12POS R/A SMD
IDT70T3539MS133BC8 IDT, Integrated Device Technology Inc IC SRAM 18MBIT 133MHZ 256BGA
1-2013928-4 TE Connectivity CONN FPC 37POS .3MM FLIP LOC SMD
IDT70V5388S133BC8 IDT, Integrated Device Technology Inc IC SRAM 1.125MBIT 133MHZ 256BGA
MPC8544AVTALF Freescale Semiconductor IC MPU POWERQUICC III 783-FCBGA
1-2013928-4 TE Connectivity CONN FPC 37POS .3MM FLIP LOC SMD
IDT70V5388S100BC IDT, Integrated Device Technology Inc IC SRAM 1.125MBIT 100MHZ 256-BGA
MPC8548ECVUAQG Freescale Semiconductor IC MPU POWERQUICC III 783-FCCBGA
1-2013928-4 TE Connectivity CONN FPC 37POS .3MM FLIP LOC SMD
CY7C1513KV18-333BZI Cypress Semiconductor Corp IC SRAM 72MBIT 333MHZ 165-FPBGA